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ESC combined with major system design show, set for Mar. 29 – Apr. 1, 2004, in SF

Nov 24, 2003 — by LinuxDevices Staff — from the LinuxDevices Archive

The Embedded Systems Conference (ESC) will be combined with the electronicaUSA system design show and several other industry conferences in 2004. It will take place Mar. 29 – Apr. 1, 2004 in San Francisco's Moscone Center. Organizers expect 18,000 attendees, 300 sessions, 500 exhibitors, and international pavilions for China, Taiwan, Singapore, Korea, Japan, and Germany.

The massive confab will amalgamate a long list of smaller shows and conferences, including:

  • Three technology conferences and programs:

    • Embedded Systems Conference: An educational program for design engineers, embedded software engineers, and technical managers. Jerry Fiddler, Chairman/Co-Founder of Wind River, will deliver a keynote address on the topic of “Envisioning the Connected World.” See the complete class listing for details.
    • Communications Design Conference: A forum where design engineers and technical managers can uncover new ideas for designing communication systems and equipment for wireless, broadband and metro access. See the complete class listing for details.
    • Power Electronics Conference: The latest power systems design challenges. See the complete class listing for details.

  • Business Events electronicaUSA: business-oriented events to facilitate interaction between executive-level managers
  • Half-day in-depth iSuppli sessions: Mon., Mar. 29: Presentations covering top-level trends in major semiconductor applications markets and developments in electronic components and supply chains
  • Daily business sessions: Topics include the global impact of environmental regulations, and the process of taking products to market in the United States.
  • C-level live discussions: Tues. Mar. 30: Discussions designed to help C-level executives and business leaders navigate the array of challenges currently facing the electronics industry
  • Emerging Technologies Forum: The latest innovations in high speed interconnect components, passive/active integration on-chip, advances in electromechanical components, MEMS, and other important design issues involved in complex system designs.

“This is truly an event where technology leaders and decision-makers meet to shape the direction of the industry, exchange ideas, identify new opportunities, and get business done,” said Paul Miller, Vice President and Group Publisher, CMP Media. “Attendees can gain ground-level information from engineers, as well as a birds-eye perspective from 30-year industry veterans.”

For more details, or to register, visit the Embedded Systems Conference Website.

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