A vendor-sponsored computing conference in Taiwan and China will explore mobile platforms, high-definition computing platforms, and emerging market innovations, including embedded applications. Via's sixth annual Technology Forum is set for Wed. through Fri., June 1-3, in Taipei, and Tues., June 7, in Beijing, China.

This year's Forum, themed “Enabling Digital Brilliance,” has expanded to three days for the first time. The event will bring together industry experts, Via partners, and Via executives, and will feature a vendor expo, as well as tracks on mobile platforms, high-definition computing, and emerging market innovation. The latter track will include sessions devoted to “exciting new applications growing up around embedded platforms,” Via says, as well as presentations about the digital divide.

“Via and our key partners [will] highlight the enabling technologies and platforms that will breathe new life into computing and personal electronics,” said Via's VP of marketing, Richard Brown.

Further details about the Forum are available online.

 
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