Samsung will unveil a new 1-chip solution for developers of smartphones and other handheld devices at the GSM World Congress Conference, held in Cannes, France later this month.

The new “System-In-Package” (SIP) component measures 17x17x1.4mm, and integrates Samsung's S3C2410 ARM-based processor along with 256MB of NAND Flash and 256MB of SDRAM memory. The S3C2410 is based on an ARM920T CPU core operating at 203 MHz. Peripherals functions integrated into the SIP chip include USB (host and device) and SDIO.

The device supports operation under embedded Linux, as well as several other embedded OSes.

 
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