Texas Instruments is sampling a high-integration, high-performance OMAP 2-based SoC (system-on-chip) processor claimed to boost video performance up to 4X and imaging performance up to 1.5X, compared with currently available mobile phone chipsets. The OMAP2430 SoC supports Linux, Windows Mobile, and Symbian, and targets next-generation 3G mobile phones, according to TI.

The OMAP2430 is fabbed in TI's 90-nanometer CMOS technology and integrates an ARM1136 RISC processor core and dedicated 2D/3D graphics hardware accelerator. The imaging subsystem supports both parallel and serial cameras and LCDs. Other on-chip interfaces include: USB 2.0 On-the-Go (OTG); IrDA, I2C, and SPI serial interfaces; and SDIO and MMC expansion card interfaces.

The OMAP2430 also includes TI's M-Shield security technology, which TI says can enable value-added services for content protection, transaction security, and secure network access, plus terminal security functions such as secure flashing and booting, terminal identity protection, and network lock protection.

OMAP2430 block diagram
(Click image to enlarge)

According to TI, the OMAP2430 includes the company's latest “IVA 2” imaging, video, and audio acceleration technology, a power-reduced version of the signal processing functionality included in the company's recently announced “DaVinci” technology. IVA 2 is a programmable engine that enables quick integration of new codec standards, codec enhancements, and stabilization algorithms, TI says.

The new chip's video subsystem supports DVD resolution decode up to 30 frames per second (fps) for MPEG4 and Windows Media Video 9 formats, and up to 30-fps VGA resolution decode for H.264 and RealVideo 10. According to TI, the advanced video compression algorithms of WMV-9 and H.264 allow operators to reduce network operating costs while delivering the same level of video quality.

TI lists the following additional multimedia features of the OMAP2430:

• Downloadable media playback and digital TV decode — MPEG4, H.264, Window Media Video 9 (VC-1), RealVideo version 10 decode up to D1 (720×480) 30 fps
• Still image capture — greater than 5 Mpixel with 1 second shot-to-shot delay
• Motion video capture — MPEG4, H.264 encoding up to VGA 30 fps
• Video teleconferencing — H.263, H.264 videoconferencing with simultaneous recording of VTC session up to CIF 30 fps
• 2D/3D gaming — rasterization up to 1 million polygons per second

Companion power management chip

To complement the OMAP2430, TI also introduced the TWL4030 “all-in-one” audio/power management component. The TWL4030 integrates voltage regulators and converters, a high-fidelity audio/voice codec, class-AB/D audio amplifiers, high-speed USB 2.0 OTG transceiver, and battery charger circuitry. The single-chip component can significantly reduce board space and system cost, according to TI.

Availability

The OMAP2430 SoC is sampling now, with production scheduled for the third quarter of 2006. The TWL4030 companion chip is expected to sample by end of the year, with production also scheduled for next year's third quarter, according to TI. Tools and development boards are expected to become available through TI's global OMAP third-party ecosystem.

 
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