Dallas, TX –(press release excerpt) — Texas Instruments Inc. (TI) announced today that wireless software developers and device manufacturers will soon be able to create and showcase innovative applications for 2.5G and 3G mobile phones, PDAs, and mobile Internet devices using a versatile new development kit for TI's OMAP processing platform. The kit supports all popular operating systems (including Linux), programming environments (such as Java), and all leading wireless standards.

TI's Innovator Development Kit for the OMAP platform will provide application developers with an open software development and demonstration environment using a modular hardware approach. The interface module, which will include a number of unique interface features, can be customized depending on a wireless device manufacturer's or OS provider's specifications for different device form factors. Optional expansion modules will include support for GSM/GPRS, 802.11b and Bluetooth. An available breakout board will include additional external peripherals and a 10Mb Ethernet connection. The Innovator kit's baseboard will give application developers the ability to easily call on the enhanced media processing capabilities of the DSP core in the OMAP 1510 processor, using familiar, existing high-level OS development tools.

The Development Kit is scheduled to ship during the third quarter of this year.

 
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