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Mobile 64-bit chips arrive on AMD’s embedded roadmap

Jan 24, 2007 — by LinuxDevices Staff — from the LinuxDevices Archive — 1 views

AMD has added two mobile processors to its AMD64 Longevity Program for embedded products. The news means that AMD's dual-core Turion 64 X2 Model TL-52 and single-core Mobile AMD Sempron 3500+ will be available for at least five years, targeting thin client and single-board computers, among other embedded applications.

AMD says parts sold under its AMD64 Longevity Program are “identical in form, fit and function” to their counterparts for the mobile PC market. However, the chips have lengthy design and qualification cycles, in addition to longer life spans in the marketplace, the company says.

Turion 64 X2, Model TL-52

AMD's Turion 64 X2 line currently includes TL-50, TL-52, TL-56, and TL-60 models that clock from 1.6GHz to 2.0GHz.

The TL-52 part clocks out at 1.6GHz, and has a pair of 512KB L2 caches. It has a thermal design power (TDP) of 31 Watts. Built on 90nm process technology, it fits AMD's zero-insertion force, 638-pin “Socket S1” for notebooks and embedded designs. It is packaged in a lidless micro-PGA.

Sempron 3500+

The AMD Sempron 3500+ mobile processor is a lower-powered, single-core part with a TDP of 25 Watts. It clocks up to 2GHz, but also has an 800MHz lower power state, with a TDP of 11 Watts.

Jeff Chu, AMD's division manager for embedded, told LinuxDevices that the “[3500+] chips boot up in the 800MHz range, then go into full frequency when needed.” This low-power boot-up default is highly desirable for power-constrained embedded applications.

AMD says both chips have proven popular with embedded customers — including thin client vendors and single-board computer manufacturers — due to their “specific balance of performance, packaging features, and thermal envelopes.” Customers reportedly include Acrosser, Albatron, Aopen, Axxtend, EPoX, and ICP.

Touted features common to both processors include:

  • Thermal management for smaller form factors
  • Socket reliability
  • Fewer pins and low profile packaging
  • Direct access to the die from the heat sink

Mobile chips in the embedded market

Intel, AMD, and Via all frequently market their mobile processor designs as high-end embedded processors. In order to do so, they typically guarantee extended lifecycle availability, and operation under extended temperature ranges.

AMD first began marketing mobile processors as embedded parts in May of 2004, when two Mobile Athlon chips became the Geode NX [email protected] and the Geode NX [email protected]. AMD rival Intel, meanwhile, added several mobile chips to its Intel Embedded Assurance (IEA) program about two years ago. Intel's dual-core Core Duo joined the IEA program last year.

AMD's embedded roadmap

Following its purchase last year of graphics chipmaker ATI, AMD launched a “Fusion” program aimed at creating chips with integrated GPUs (graphics processing units). Chu said, “We don't have too much to say right now. We're looking forward to integrating the graphics with what we have. The initiative is called 'Fusion,' but it's quite long-term.”

Regarding today's release of two AMD64 mobile processors to the company's embedded roadmap, Greg White, AMD's VP of embedded products, stated, “This is the first in a series of steps AMD expects to take to broaden its embedded product offerings and support throughout 2007.”

In other embedded news, AMD in June sold its Alchemy line to Raza Microelectronics Inc. (RMI). Then, a month later, it moved its embedded design center.


Both the The Turion 64 X2 Model TL-52 and AMD Sempron Mobile Processor Model 3500+ are available now. Pricing was not disclosed.

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