IBM has made series of chip announcements, including 90nm copper-process 750- and 970-series PowerPC processors targeting storage and communications; a new, more energy-efficient northbridge for 9xx-series chips; and, several 46x-series cores in synthesizable and 90nm hard versions. All share a common “low-power” theme.

750CL

The 750CL processor, currently sampling, is built on 90nm copper process technology. It is positioned as a more energy-efficient alternative to IBM's currently shipping 750CX and 750GX processors for storage and networking appliances.

750CL function block diagram
(Click to enlarge)

The 750CL will clock between 400MHz and 900MHz, while drawing 3-7 milli-Watts per clock cycle. The older 750-series chips, in comparison, draw 10 to 14 milli-Watts. It includes a 256KB L2 cache, and targets “networking, storage, imaging, consumer electronics, and other high-performance embedded applications,” IBM says.

970GX

The 970GX processor was announced quite a while ago, when Apple was still using IBM's 970 processor (aka “G5”) in its high-end desktop PCs. At that time, the 970GX was positioned as a single-core version of the 970MP, and an upgrade to the 970FX. Now that it is shipping, the 970GX is positioned as “suitable for communications, storage, multimedia, and graphics based devices.”

IBM describes the new chip as having “the same power capabilities” as the older 970FX, but with a full 1MB of L2 cache, and support for clock speeds from 1.2GHz to 2.5GHz. The chip can execute both 32-bit and 64-bit code.

New 9xx-series northbridge

The 970GX and other 970-series PowerPC processors will be supported by a new low-powered CPC965 northbridge, expected to sample in March of next year. The CPC965 is expected to support frontside bus speeds of up to half of the processor's clock frequency. And, it is expected to run at “significantly less power” than similar 970-series companion chips, IBM says.

PowerPC 460 core series

Finally, IBM has announced three new 32-bit processors for use in SoCs (system-on-chip processors) and ASICs (application-specific integrated circuits) targeting markets such as communications, networking, aerospace and defense, consumer electronics, storage, and printers:

• The 460S synthesizable core, expected in Q2, 2007, will let SoC designers customize L1 and L2 cache sizes, IBM says. The design will feature a processor local bus (PLB), in order to support single- or multi-processor designs. And, it will support manufacturing by “any fabricator worldwide,” IBM claims.
• The 464 H90 hard core (i.e., not synthesizable), expected in Q4, 2006, will offer a customizable core for ASICs that can be manufactured with IBM or at “Common Platform” manufacturing facilities at Chartered or Samsung.
• The 464FP H90, expected in Q1, 2007, is a hard core that adds a double precision FPU (floating point unit).

All three 460 series cores will feature low-power capabilities, with the 464 H90 expected to dissipate 530mW at 1GHz. Additional touted features include local bus connectivity, and broad application support.

 
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